As of April 2026, calculate Gross Dies Per Wafer (GDPW) and net die yield for any chip design. Enter die dimensions and wafer size to see how many good dies per wafer, factoring in edge exclusion, flat/notch losses, and defect density. Supports TSMC N3, N5, N4, Samsung, Intel, and GlobalFoundries nodes from 180nm to 2nm. Includes wafer procurement cost ($3,000–$19,500 by node), scribe line loss, Poisson and Murphy yield models, advanced packaging costs (CoWoS, EMIB, SoIC), HBM memory pricing ($200–$500/stack), and margin analysis. Free alternative to paid die calculators — no subscription or signup required.
An interactive tool for estimating semiconductor costs.
Choose a chip type to get started. Each preset loads realistic parameters for that category — you can customize everything afterward.
| Driver | Assumption | Est. Price | Impact |
|---|---|---|---|
| Yield | +5% | $12,398 | -$161 |
| Yield | 56.1% | $12,559 | — |
| Yield | -5% | $12,752 | +$193 |
| Cost Component | Unit Cost | % of ASP |
|---|---|---|
| Silicon (Die) | $552 | 4.4% |
| Packaging & Test | $85 | 0.7% |
| Memory (HBM) | $2,880 | 22.9% |
| OpEx & Margin | $9,043 | 72.0% |
| Total ASP | $12,559 | 100.0% |
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The manufacturing cost of a semiconductor chip is determined by a chain of interdependent variables: wafer price, die area, process yield, defect density, packaging type, and test costs. Understanding how each factor contributes to the final chip cost breakdown is essential for procurement teams, design engineers, and hardware investors evaluating silicon economics.
Wafer pricing is the foundation of chip manufacturing cost. A 300mm wafer on TSMC's N3 process is estimated at $18,000–$20,000, while mature nodes like 28nm cost $3,000–$4,000. The cost scales with process complexity: extreme ultraviolet (EUV) lithography, additional metal layers, and tighter defect tolerances all drive up wafer cost at leading-edge nodes. Foundry pricing also varies by supplier—TSMC typically commands a premium over Samsung and Intel Foundry Services due to yield maturity and capacity allocation.
Yield modeling is critical because not every die on a wafer is functional. The die yield calculator in this tool uses industry-standard models (Poisson and Murphy) to estimate the percentage of good dies based on die area and defect density. Larger dies have exponentially lower yields—a 600mm² die at 5nm may yield only 40–50% good chips, meaning the effective cost per good die roughly doubles compared to the raw wafer cost divided by total dies.
Advanced packaging has become a significant cost driver for AI accelerators. Technologies like TSMC's CoWoS (Chip-on-Wafer-on-Substrate) and Intel's EMIB add $500–$1,500+ per package depending on interposer size, HBM stack count, and substrate complexity. Test and assembly costs include wafer probe testing, final package test, and burn-in—typically adding $100–$500 per unit for complex AI chips.
This semiconductor manufacturing cost calculator lets you model all these variables interactively. Adjust process node, die size, yield assumptions, packaging type, and volume to see how each factor affects the total cost per chip. Compare scenarios across TSMC, Samsung, Intel, GlobalFoundries, SMIC, and other foundries with real-world pricing benchmarks.
Related: Browse semiconductor analysis articles · Advanced Packaging Cost Model · Cost Bridge Chart
All benchmarks and data are derived from publicly available sources (earnings calls, press releases, analyst reports, regulatory filings). Figures are estimates for educational purposes only and should not be used as the sole basis for business or investment decisions. Wafer pricing and yield benchmarks are industry estimates subject to NDA-specific variations. Full Terms & Data Provenance
Calculate Gross Dies Per Wafer (GDPW) and net die yield for any chip design. Enter your die dimensions and wafer size to instantly see how many good dies you can expect per wafer, factoring in edge exclusion, flat/notch losses, and defect density.
Gross Dies Per Wafer estimates the maximum number of rectangular dies that fit on a circular wafer. The standard formula accounts for wafer diameter (typically 300mm), die area (X × Y mm), and edge exclusion zones. Our calculator extends this with Murphy’s yield model to give you net good dies — the number you can actually sell after accounting for defect density.
Silicon Analysts’ chip cost calculator provides GDPW, net die yield, and full chip cost modeling — including wafer costs, advanced packaging (CoWoS, EMIB), and HBM memory pricing — completely free. No subscription required. Model costs from 28nm through 2nm with real-time parameter adjustments.
Looking for a comprehensive reference? Read our guide: How Many Chips Fit on a Wafer →