πŸ“‹Provenance & Quality

Data Quality & Provenance

Every record returned by every Silicon Analysts tool β€” REST or MCP β€” carries a provenance block describing where the data came from, how confident we are in it, and when it was last refreshed. This page is the canonical reference for what those fields mean.

Where our data is least certain

We publish ranges, not false precision. These are the datapoints where our published range is widest β€” where the real number is hardest to pin down, and where input from people who work with these numbers would move us most. Confidence here is inferred from the width of the published range.

DatapointPublishedRange & confidenceSpreadWhat’s your number?
SMIC 22/28nmwafer price$2,000$1,500–$2,50050%
UMC 40/45nmwafer price$2,000$1,500–$2,50050%
Intel 7wafer price$6,500$5,000–$8,00046%
TSMC 3nm (N3)wafer price$20,000$18,000–$27,00045%
GlobalFoundries FDX (22FDX/12FDX)wafer price$3,200$2,500–$3,90044%
UMC 22/28nmwafer price$2,800$2,200–$3,40043%
GlobalFoundries 12nm (12LP/12LP+)wafer price$4,200$3,500–$4,90033%
iot-edgegross margin45%35%–50%33%

Drop your own number in any row to see how it compares to the crowd β€” input is anonymous and aggregated (individual values are never shown; the distribution unlocks at 3 contributions). Have a source? Logged-in users can suggest a reviewed correction β€” how contributions are handled.

How community data works

We invite the people who use these tools to sharpen the numbers β€” but a number nobody can trust is worse than no number. Here’s exactly how contributions are handled.

Anonymous by default

No account or email needed. We store only the value and which datapoint it’s for, to compute a community range β€” never tied to your identity, never shown individually. The range also reflects adjustments people make in our tools; you can opt out of being included at any time.

The crowd informs, we decide

Contributions never change our published numbers automatically. Sourced corrections go to a review queue we vet by hand; implausible values are bounded out, and any stray number is absorbed harmlessly into a median β€” it can’t move what we publish.

Three labels, never blurred

A number is always one of: our published estimate (vetted), the community signal (n contributors, median + confidence), or validated (a sourced correction we reviewed). We never present crowd input as fact.

Showing our confidence β€” and where the crowd disagrees β€” isn’t a weakness. It’s how we stay honest about what’s known versus estimated.

Provenance Taxonomy

Two enums classify every record: source_type (how the record was produced) and confidence_tier (how much to trust it). The type contract lives in lib/tools/types.ts.

source_type β€” how this record was produced

research

Sourced from a published external report (Morgan Stanley, TrendForce, public earnings, etc.). Direct attribution.

derived

Computed by Silicon Analysts from public inputs via a documented methodology (Monte Carlo cost models, yield equations, etc.).

computed

Pure-function output from user-supplied inputs (e.g. calculate_chip_cost results). No data lookup involved.

estimated

Analyst judgment where data is sparse or unobservable.

confidence_tier β€” qualitative confidence

high

Multiple independent sources agree; methodology is well-tested.

medium

Single authoritative source or moderate methodology uncertainty.

low

Sparse data, significant assumptions, or rapidly changing.

Why a tier and not a 0–1 number? A spurious 0.85 is worse than a reasoned "high" β€” agents will treat the number as more precise than it is. We will tighten to a numerical confidence once the methodology for computing it is documented.

Methodology & Models

The calculators run documented, industry-standard models β€” published here (and in /llms.txt for AI agents) so anyone consuming a number can assess how it was produced.

Yield models

User-selectable Poisson Y = eβˆ’AΒ·D0 and Murphy Y = ((1 βˆ’ eβˆ’AΒ·D0) / (AΒ·D0))2, where A is die area in cmΒ² and D0 is defect density in defects/cmΒ².

Defect-density maturity

D0 scales by production phase (risk / ramp / high-volume). The risk factor derives from tracked per-node early-vs-mature defect densities (e.g. TSMC N3: 0.14 early vs 0.09 mature β‰ˆ 1.56Γ—), with a documented 1.4Γ— fallback when a node lacks an early figure; ramp uses the geometric midpoint (√ratio). A small assembly-yield hit applies in immature phases (risk Γ—0.97, ramp Γ—0.99). These phase factors are SA estimates and labeled as such in the tools.

Chiplet economics

Multi-die designs use known-good-die (KGD) costing β€” default KGD yield 98.5%, packaging cost scaled +15% per die beyond the first, up to 4 dies, with assembly yield compounding per die. Optional 3D stacking compounds per-layer bond yield: Ystack = Ybond(layersβˆ’1) (US8466542), 1–8 layers, default 100% (an exact no-op). Bond-yield presets: mature 98% (ECTC 2026); ramp/early-ramp figures are SA estimates β€” Samsung's HBM4 hybrid-bonding ramp has been publicly reported near ~10%.

Manufacturing-energy adder (opt-in)

kWh per wafer start by node (~200–400 legacy up to ~800–1,500 at 3nm; ASML/imec/McKinsey public figures) Γ— regional industrial electricity rate across 7 fab regions (EIA, Taipower, KEPCO tariffs) Γ— an optional ~1.75Γ— facility-overhead multiplier (SA estimate β€” facility systems draw 50–57% of total fab electricity). Wafer price already embeds foundry energy, so the adder is a regional attribution / scenario delta, not an additional BOM line. Off by default; labeled SA est. wherever shown.

Explicit gaps β€” not modeled

Two packaging-economics quantities have no credible public figure and are deliberately not in the model: the hybrid-bonding cost delta vs micro-bump in $/wafer (only tool-throughput proxies exist β€” noted qualitatively on SoIC-class entries), and thermal-derate-to-cost rules (power-density ceilings stay qualitative). We document gaps rather than invent parameters.

Wafer price consensus

Multi-source corroborated wafer prices are rounded to $250 steps and published as bands (min/avg/max) β€” deliberate precision honesty. The what-changed feed applies a 1% significance floor on wafer pricing so rounding wobble never reads as a real movement.

Update Cadence by Dataset

Last-updated dates below are dataset-level. Per-record overrides are supported in the API; future migrations will populate them as individual chips, nodes, and packaging types refresh asynchronously. Cadence is a target β€” historical refresh history will appear on a planned /changelog page.

DatasetLast UpdatedTarget CadenceSource Types
AI Accelerators (chipSpecs)
Per-chip cost breakdowns derived from Monte Carlo models against public teardown data and analyst reports.
2026-10-04Monthly
derivedresearch
Foundry & Wafer Pricing (foundryData)
Wafer price ranges, defect density, NRE/mask-set costs, and node maturity status. Synthesized from TrendForce, Morgan Stanley, CSET, public filings.
2026-08-04Quarterly
derivedresearch
Packaging & HBM Specs (packagingData)
Per-tech packaging cost benchmarks (CoWoS-S/L, EMIB, SoIC, FC-BGA, etc.) plus HBM2 β†’ HBM4 cost-per-stack and bandwidth/capacity.
2026-09-13Monthly
derivedresearch
HBM Market Analysis (hbmData)
9 sub-tables: accelerators, specs, market share, spot prices (retired 2026-07-28, frozen), leading indicators, qualification feed, revenue forecast, supplier revenue, validation checks.
2026-09-13Monthly
researchderived
Supply-chain Headlines (marketPulse)
Curated supply-chain headlines with trend direction and impact analysis. Per-item dates parsed to ISO 8601 in the API.
β€”Weekly
research

Methodology Notes by Source Type

research

Research

Records attributed directly to a public external publication. Primary sources include TrendForce quarterly reports, Morgan Stanley semiconductor research, Raymond James analyst notes, CSET, IEDM proceedings, and earnings releases. Each record carries a per-row source string in addition to the structured provenance block.

derived

Derived

Records produced by a Silicon Analysts model from public inputs. Examples: per-accelerator cost breakdowns combine Epoch AI Monte Carlo models with TrendForce and Raymond James inputs; wafer price ranges synthesize multiple foundry-pricing sources with the Murphy yield model. See Semiconductor Cost Guide for the methodology in depth.

computed

Computed

Pure-function output from user-supplied inputs. The calculate_chip_cost tool is the only example today: given die dimensions and process parameters, returns an estimated chip cost. No data lookup is involved at the record level (though input defaults pull from derived wafer-pricing data β€” that data's freshness sets the ceiling on result freshness via the conservative-pick rule).

estimated

Estimated

Analyst judgment where data is sparse or unobservable. Rare today; reserved for fields like packaging cost on early-life tech where no published price exists. Always paired with low or medium.

Example: Provenance in a Tool Response

Every record across every tool carries the same shape. Below is a representative get_accelerator_costs record (truncated).

{
  "chip": "NVIDIA B200",
  "vendor": "NVIDIA",
  "processNode": "TSMC 4NP",
  "estMfgCostUsd": 6750,
  "estSellPriceUsd": 40000,
  "costBreakdown": { "logicDieCostUsd": 850, "hbmCostUsd": 3250, ... },
  "provenance": {
    "last_updated":   "2026-04-07T00:00:00.000Z",
    "source_type":    "derived",
    "confidence_tier": "high",
    "dataset_version": "chipSpecs-v1.0"
  }
}

See the Developer API page for full per-tool response shapes and the /api/v1 manifest for the machine-readable contract.

Related

Immutability & validation

The record is written in pen, not pencil. Here is exactly how a number gets published, why it can't be silently changed afterward, and what happens when one turns out to be wrong.

A frozen daily ledger

Every day since 6 June 2026, the day's published values are photocopied into an append-only ledger. Those rows can never be edited or deleted β€” the database itself rejects the attempt, even from our own admin account. You can replay any past date exactly as it stood via /api/v1/snapshot?date=YYYY-MM-DD. History is never backfilled or rewritten.

Four checks before anything is published

A value must clear every gate to reach the record: (1) database bounds reject impossible values at the source; (2) a pre-freeze validator refuses to freeze an impossible value β€” the ledger takes a visible one-day gap instead of a permanent wrong number, and an operator alert fires; (3) automated agents only publish a figure when at least two independent public sources agree; (4) any human-approved edit is re-validated against the same bounds at approval time. A value that fails the freeze two days running is auto-reverted to the last frozen valid value β€” and that revert is itself logged as a public correction.

Corrections are public, never silent

When a published value later proves wrong, it is corrected in the open: an immutable brief is archived and a corrected one re-published; a frozen ledger day is annotated with the affected date range. Every correction is recorded in the public changelog below and served inline by the API for the dates it touched. Sourcing is public-only β€” no insider data β€” so every claim is checkable at its source.

Corrections changelog

Published data is immutable β€” frozen ledger days and event timelines are never edited. When a value turns out to be wrong, the correction is recorded here (and served inline by /api/v1/snapshot, /api/v1/export and /api/v1/changes for the affected dates).

/tools/cluster-tco:cost-per-tflop-month Β· bf16_tflops_basispage_copycommunity-sourced correction2026-10-14
BF16 TFLOPS per GPU: B200 4,500; GB200 4,500; MI350X 5,000 (sparse); H100 / H200 989; MI300X 1,307 (dense). At the defaults (1,024 GPUs, 3 years, colo): B200 $0.47, GB200 $0.42, MI350X $0.28 per TFLOP-month β†’ Dense BF16 for every GPU: B200 2,250; GB200 2,500; MI350X 2,300; H100 / H200 989; MI300X 1,307. At the same defaults: B200 $0.95, GB200 $0.75, MI350X $0.61 per TFLOP-month; H100, H200 and MI300X unchangedaffected 2026-04-08 β†’ 2026-10-14
Calculation correction, not a market move: the Cluster TCO calculator divided by dense BF16 TFLOPS for H100, H200 and MI300X but by the 2:4 structured-sparsity figures for B200, GB200 and MI350X, so those three showed about half their cost per TFLOP-month. Every GPU now uses dense BF16, from the chip record behind /api/v1/accelerators (B200 2,250; GB200 2,500 per GPU) and AMD's MI350X specification (2.3 PFLOPS dense). Cost per GPU-month and total cost of ownership did not change.
samsung|amd mi355x|hbm3e| Β· matrix_rowhbm_qualification_feedcommunity-sourced correction2026-10-13
volume_shipping @ 2025-06-01 (kedglobal.com) β†’ retractedaffected 2026-10-13
Duplicate of Samsung x AMD MI350 x HBM3E 12-Hi (MI355X is part of the MI350 series, 12-high); one relationship keeps one row.
samsung|nvidia|hbm3e| Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
qualified @ 2026-06-01 β†’ withdrawnaffected 2026-08-01 β†’ 2026-10-13
The cited article (The Elec, 2026-06-05) reports NVIDIA's CEO on HBM4 suppliers for Vera Rubin. It is not evidence about HBM3E, and it was filed under the company name rather than a platform.
micron|nvidia vera rubin|hbm4| Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
qualified @ 2026-06-01 β†’ withdrawn (duplicate)affected 2026-06-22 β†’ 2026-10-13
Filed under a duplicate of Micron x NVIDIA Vera Rubin x HBM4 12-Hi with no stack height (NVIDIA states Rubin uses 12-high stacks). NVIDIA's CEO confirmed in June 2026 a supply relationship recorded there from March.
sk hynix|nvidia gb300|hbm3e|12-hi Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
qualified @ 2025-03-01 β†’ volume_shipping @ 2025-05-01affected 2026-06-10 β†’ 2026-10-13
The cited report (TrendForce, 2025-03-18) describes an exclusive-supplier deal, which is supplier selection rather than a qualification pass. SK hynix was reported supplying 12-layer HBM3E for GB300 from May 2025.
samsung|nvidia|hbm4|12-hi Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
volume_shipping @ 2026-02-01 β†’ withdrawn (duplicate)affected 2026-07-13 β†’ 2026-10-13
A news report of the 2026-02-12 shipments. Filed under the company name; NVIDIA's only HBM4 platform is Vera Rubin. Recorded on Samsung x NVIDIA Vera Rubin x HBM4 12-Hi.
sk hynix|nvidia|hbm3e|12-hi Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
volume_shipping @ 2026-06-01 β†’ withdrawnaffected 2026-07-10 β†’ 2026-10-13
The cited article (The Elec, 2026-06-05) reports NVIDIA's CEO on HBM4 suppliers for Vera Rubin. It is not evidence about HBM3E, and it was filed under the company name rather than a platform.
sk hynix|nvidia rubin|hbm4| Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
in_qualification @ 2025-12-01 β†’ withdrawn (duplicate)affected 2026-09-25 β†’ 2026-10-13
A distributor's repost of a TrendForce report. Filed under 'NVIDIA Rubin', the Vera Rubin GPU. The qualification stage is recorded on SK hynix x NVIDIA Vera Rubin x HBM4 12-Hi.
samsung|nvidia|hbm4| Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
in_qualification @ 2026-01-01 β†’ withdrawn (duplicate)affected 2026-07-10 β†’ 2026-10-13
Same-week report that approval was near. Filed under the company name; NVIDIA's only HBM4 platform is Vera Rubin. Samsung x NVIDIA Vera Rubin x HBM4 12-Hi records the pass of 2026-01 and the first commercial shipments of 2026-02-12.
samsung|nvidia|hbm3e| Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
volume_shipping @ 2025-09-01 β†’ withdrawnaffected 2026-07-01 β†’ 2026-10-13
The cited article (The Elec, 2026-06-05) reports NVIDIA's CEO on HBM4 suppliers for Vera Rubin. It is not evidence about HBM3E, and it was filed under the company name rather than a platform.
sk hynix|nvidia|hbm4| Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
in_qualification @ 2025-10-01 β†’ withdrawn (duplicate)affected 2026-06-29 β†’ 2026-10-13
SK hynix's plan to begin HBM4 supply in Q4 2025. Filed under the company name; NVIDIA's only HBM4 platform is Vera Rubin. The qualification stage is recorded on SK hynix x NVIDIA Vera Rubin x HBM4 12-Hi from the same month.
samsung|amd mi355x|hbm3e| Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
volume_shipping @ 2025-06-01 β†’ withdrawn (duplicate)affected 2026-10-13
MI355X is part of the MI350 series (288GB, 12-high stacks); the same supply is recorded on Samsung x AMD MI350 x HBM3E 12-Hi.
samsung|nvidia|hbm3e| Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
volume_shipping @ 2026-06-01 β†’ withdrawnaffected 2026-08-28 β†’ 2026-10-13
The cited article (The Elec, 2026-06-05) reports NVIDIA's CEO on HBM4 suppliers for Vera Rubin. It is not evidence about HBM3E, and it was filed under the company name rather than a platform.
micron|nvidia vera rubin|hbm4|16-hi Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
sampling @ 2026-01-01 β†’ withdrawnaffected 2026-06-29 β†’ 2026-10-13
Micron's release says 16-high HBM4 samples went to customers without naming one, and NVIDIA states that Rubin uses 12-high stacks.
sk hynix|nvidia|hbm3e| Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
volume_shipping @ 2025-09-01 β†’ withdrawnaffected 2026-08-19 β†’ 2026-10-13
The cited article (The Elec, 2026-06-05) reports NVIDIA's CEO on HBM4 suppliers for Vera Rubin. It is not evidence about HBM3E, and it was filed under the company name rather than a platform.
samsung|nvidia b300|hbm3e|12-hi Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
failed @ 2024-04-01 β†’ withdrawnaffected 2026-06-10 β†’ 2026-10-13
The 2024 report of Samsung HBM3E failing NVIDIA's heat and power tests concerned NVIDIA's earlier GPUs; it predates the B300 / GB300 generation, announced in March 2025.
samsung|nvidia b300|hbm3e|12-hi Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
failed @ 2025-06-01 β†’ moved to NVIDIA GB300affected 2026-06-10 β†’ 2026-10-13
B300 and GB300 are the same Blackwell Ultra GPU; recorded under NVIDIA GB300, the name the other suppliers' rows use.
micron|nvidia b200|hbm3e|12-hi Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
qualified @ 2024-09-01 β†’ withdrawnaffected 2026-06-10 β†’ 2026-10-13
The cited article (2024-09) reports production-ready 12-high samples shipped to partners for qualification, naming no customer. Micron's 12-high HBM3E went into the B300 / GB300 generation; the B200 uses 8-high stacks (Micron, 2025-03-18).
samsung|nvidia|hbm3e| Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
qualified @ 2025-09-01 β†’ withdrawnaffected 2026-09-16 β†’ 2026-10-13
The cited article (The Elec, 2026-06-05) reports NVIDIA's CEO on HBM4 suppliers for Vera Rubin. It is not evidence about HBM3E, and it was filed under the company name rather than a platform.
micron|nvidia|hbm3e|12-hi Β· statushbm_qualification_eventssuperseded by a later event2026-10-13
volume_shipping @ 2026-06-01 β†’ withdrawnaffected 2026-07-22 β†’ 2026-10-13
The cited article (The Elec, 2026-06-05) reports NVIDIA's CEO on HBM4 suppliers for Vera Rubin. It is not evidence about HBM3E, and it was filed under the company name rather than a platform.