The global semiconductor fab landscape is concentrated among a handful of companies and geographies. Understanding where chips are manufactured—and the capacity constraints at each location—is critical for supply chain risk assessment, procurement planning, and geopolitical analysis. This tool maps 100+ semiconductor fab locations with filterable data on process nodes, capacity, and ownership.

Key Players and Geographic Footprints

TSMC dominates leading-edge production with major fabs in Hsinchu, Tainan, and Kaohsiung (Taiwan), plus expanding operations in Arizona and Kumamoto (Japan). Samsung operates advanced fabs in Pyeongtaek (South Korea) and Taylor (Texas). Intel's foundry fabs span Oregon, Arizona, Ireland, and Israel. SMIC in China focuses on mature and mid-range nodes, while Rapidus in Japan is targeting 2nm production. Together, these companies represent the vast majority of global chip manufacturing capacity.

Location, Cost, and Supply Chain Risk

Fab location directly affects manufacturing cost through labor rates, utility prices, government subsidies, and logistics. It also determines supply chain resilience—the concentration of leading-edge capacity in Taiwan has driven diversification efforts worldwide. Natural disasters, geopolitical tensions, and water scarcity can disrupt production at any single site, making geographic diversification a priority for chip buyers.

Government Incentives Reshaping the Map

The U.S. CHIPS Act ($52B), EU Chips Act (€43B), Japan's semiconductor subsidies, and India's incentive programs are fundamentally reshaping foundry capacity distribution. New fabs in Arizona, Ohio, Dresden, and Kumamoto will add significant capacity over 2025–2028, though ramp timelines and cost structures remain uncertain. This explorer tracks both operational and under-construction facilities.

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