Packaging Model - Advanced 2.5D/3D Packaging Cost Calculator
Model and compare semiconductor packaging costs for CoWoS-S, CoWoS-L, EMIB, SoIC, and flip-chip architectures. Analyze interposer yield, HBM stack costs, and total package economics for AI accelerators and HPC chips. Supports HBM3, HBM3e, and HBM4 configurations with interactive cross-section visualization.
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Silicon Analyst Pro
Advanced 2.5D/3D Packaging Visualizer & Financial Modeler
Application Category
High-Performance Computing and AI accelerators
Packaging Architecture
Silicon Interposer. Standard for monolithic high-end chips.
Logic Configuration
Memory Configuration
Financial Analysis
Visualizer
HBM Technology Comparison
| Type | Bandwidth | Capacity | Speed (Pin) | Key Features |
|---|---|---|---|---|
HBM2 | 256 GB/s | 8 GB | 2.0 Gbps | Legacy. V100 era. |
HBM2e | 460 GB/s | 16 GB | 3.6 Gbps | Standard A100 era. |
HBM3 | 819 GB/s | 24 GB | 6.4 Gbps | Mainstream H100. |
HBM3e | 1.2 TB/s | 36 GB | 8.0+ Gbps | Cutting Edge H200/B200. |
HBM4 | >2 TB/s | 48 GB | High | Future Gen. |
Understanding Advanced Packaging Costs
Advanced packaging has become a defining cost driver for modern AI accelerators. As chiplet architectures replace monolithic designs and HBM memory stacks grow taller, the packaging cost now rivals or exceeds the logic die cost for many high-end chips. Understanding CoWoS packaging cost structures and alternatives is essential for anyone evaluating semiconductor economics.
CoWoS-S vs CoWoS-L: When to Use Each
TSMC's Chip-on-Wafer-on-Substrate (CoWoS) platform comes in two main variants. CoWoS-S uses a silicon interposer to connect the logic die and HBM stacks, offering excellent signal integrity but limited by reticle size (~~800mm² interposer). CoWoS-L uses a chip-last approach with an organic interposer and local silicon interconnect (LSI) bridges, enabling larger package sizes needed for chips like NVIDIA's B200 with its dual-die design. CoWoS-L packages typically cost 20–40% more than CoWoS-S due to the additional complexity and lower yields on larger interposers.
HBM Stack Cost and Integration
HBM packaging is a major cost component. Each HBM3E stack (8-high or 12-high) costs $60–$120 depending on capacity, and a single AI accelerator may require 4–8 stacks. The HBM stacks must be bonded to the interposer with precise microbump alignment, and each additional stack increases both material cost and yield risk. The transition from HBM3 to HBM3E to HBM4 will further increase per-stack costs while delivering higher bandwidth.
Intel EMIB and Alternative Approaches
Intel's Embedded Multi-die Interconnect Bridge (EMIB) offers a different approach to chiplet packaging cost optimization. Instead of a full-size silicon interposer, EMIB embeds small silicon bridges directly in the organic substrate only where die-to-die connections are needed. This reduces silicon usage and can lower costs for certain configurations, though EMIB currently has lower interconnect density than CoWoS. Other approaches like TSMC's SoIC (System on Integrated Chips) enable true 3D stacking with even higher density but at increased cost.
Related: Chip Price Calculator · HBM Market Analysis · Cost Bridge Chart