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Silicon Analyst Pro

Advanced 2.5D/3D Packaging Visualizer & Financial Modeler

Load Configuration

Silicon Interposer. Standard for monolithic high-end chips.

Die Area (mm²)600

400|858|1800

HBM Generation

Stack Count4 Stacks

Reticle Multiplier1.5x

Defect Density (D0)0.005/cm²

0.001 (Passive/Mature)0.05 (High Risk)

Total BOM

$3,110

Logic

Memory

Pkg

Yield

Target Sales Price (ASP)

Est. Gross Margin87.6%

Visualizer

Logic: 600mm²

HBM3 (4x)

SI Interposer (1.83x)

Organic Substrate

CoWoS-S (2.5D)

Type	Bandwidth	Capacity	Speed (Pin)	Key Features
HBM2	256 GB/s	8 GB	2.0 Gbps	Legacy. V100 era.
HBM2e	460 GB/s	16 GB	3.6 Gbps	Standard A100 era.
HBM3	819 GB/s	24 GB	6.4 Gbps	Mainstream H100.
HBM3e	1.2 TB/s	36 GB	8.0+ Gbps	Cutting Edge H200/B200.
HBM4	>2 TB/s	48 GB	High	Future Gen.