What Changed — Semiconductor Data Movements
Recent movements in semiconductor wafer pricing, AI accelerator manufacturing cost, foundry gross margins, foundry capacity, and NRE/mask-set cost, derived daily from an append-only data ledger. Each movement shows direction, magnitude, the two dates compared, and a confidence tier. Public sources only — no proprietary or insider data.
What Changed in Semiconductor Data
Recent movements across wafer pricing, AI accelerator cost, foundry margins, capacity, and NRE — tracked daily from our public-data ledger, every figure with provenance.
Comparing Jul 25, 2026 vs Jun 25, 2026 (35 days of history) ·
Fab capacity & utilization1
View dataset →| Metric | Change | Move |
|---|---|---|
| TSMC CoWoS node ramp | 56 → 60 | ▲ +7.1% |
Foundry capacity2
View dataset →| Metric | Change | Move |
|---|---|---|
| TSMC N3 annual wafer starts | 1,890,000 wafers_per_year → 2,160,000 wafers_per_year | ▲ +14.3% |
| TSMC 28 annual wafer starts | 1,740,000 wafers_per_year → 1,560,000 wafers_per_year | ▼ -10.3% |
Gross margins2
| Metric | Change | Move |
|---|---|---|
| AUTOMOTIVE MCU gross margin | 57.1% → 45% | ▼ -12.1pp |
| MAINSTREAM CPU gross margin | 53% → 44.575% | ▼ -8.4pp |
Download the full historical ledger (Pro)
Every figure here is a dated, append-only series. Get the complete history as CSV/JSONL for backtesting and models — join the list and we'll reach out.
Market intelligence behind the moves
All market intelligence →SK Hynix Commits $5.8B to Advanced HBM Packaging Facility; TSMC Confirms 2027 Wafer Price Hikes Up to 10%
SK Hynix packaging CapEx: +$5.8B committed; TSMC mature-node wafer price hike: up to +10% effective 2027; advanced-node pricing direction unquantified but directionally upward per Barchart/TSMC guidance.
China Eyes Export Controls on AI Chips & Models; AMD Helios Rack Enters Market with Azure Deal
Geopolitical: Potential restriction on TSMC fab access for Chinese-designed advanced chips (scope/timing unquantified); AMD Helios: Azure H2 2026 deployment commitment (unit volume undisclosed).
TSMC Commits $100B+ Arizona Expansion, Accelerates 3nm Conversion to Meet AI Chip Surge
Capacity: TSMC U.S. CapEx raised by +$100B incremental; total U.S. commitment reaches ~$265B per Odaily/Reuters; annual CapEx guidance lifted to $60–64B. 5nm-to-3nm fab conversion timeline accelerated (no specific % capacity figure disclosed publicly).
TSMC $265B US CapEx Commitment + ASML 30% EUV Capacity Surge Signal Multi-Year AI Supply Expansion — with Equipment Price Hike Risk
TSMC CapEx: +$100B incremental US commitment (total $265B), 2026 CapEx at high end of $52–56B range; ASML EUV/DUV capacity: +30% per year for 2 years; ASML 2026 revenue guidance raised ~15–19% vs prior midpoint (€38B → €44B midpoint); ASML EUV price hike quantum not yet disclosed — wafer/packaging cost pass-through risk flagged but unquantified.
Recent corrections
Full changelog →Methodology
Every day we freeze the canonical semiconductor cost/pricing data into an append-only ledger. This page compares the most recent snapshot against the closest one ~30 days earlier and surfaces the metrics that moved past a per-dataset significance threshold (filtering out rounding noise).
Each movement shows direction, magnitude (percent for value metrics, percentage-points for rate metrics), the two dates compared, and a confidence tier. The trend column sketches each metric's full ledger history (up to ~90 days). The history is young — the ledger began 2026-06-06, and some domains are tracked from later dates — so a 30-day window automatically clamps to the data available and labels the real lookback, and per-row trends can start on different dates. Underlying values are synthesized from public sources only.
Programmatic access: /api/v1/changes and the get_recent_changes MCP tool. For data provenance and terms, see Terms & Data Provenance.
See current wafer pricing →
300mm wafer prices by node and foundry, with per-row provenance and price ranges.