Semiconductor Component Lead Times

Name: Semiconductor Component Lead Times
Creator: Silicon Analysts

Lead times in weeks for key AI chip supply chain components: CoWoS packaging, HBM memory by generation, TSMC leading-edge wafers.

Coverage window: Q1 2022 → Q1 2026 (34 rows)
Computed from the backing series at page-render time — never typed by hand.
History honesty: Observations recorded as published; no archive backfill flag on this series.
Cadence: Weekly — cost models recompute when inputs move (Monday refresh fleet, 11:00–12:30 UTC); values are stable between input changes.
Revision policy: Points change only through staged updates (market_data_staged_updates) with an audit log; the Pro export carries X-Corrections-Count.
Sources (source_name): Silicon Analysts estimate Mar 2026 (4) · TrendForce Q2 2024 (1) · TrendForce / DeepResearch (1) · TSMC Q3 2023 earnings (1) · Industry estimates Q2 2024 (1) · TSMC earnings Q2 2023 / SemiAnalysis (1) · Goldman Sachs semi report Dec 2023 (1) · DigiTimes / SemiAnalysis (1)
Known gaps: Known-gaps review pending — the coverage boundaries above are computed and current, but the curator’s qualitative gaps assessment has not been written yet. We state that rather than inventing one.
Access: Free API key
API: /api/v1/market-data/component-lead-times
Machine-readable: /api/v1/catalog/component-lead-times/contract